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Leiton printed circuits | PCB | production | India | Multilayer | Flex

News, offers and useful information about Leiton PCBs

18/7/2025

Blind-, Buried & Microvias

VIAs (Vertical Interconnect Access) enable electrical connections between multiple copper layers of a printed circuit board (PCB). There are different types of VIAs with various advantages and disadvantages, which are selected according to the design requirements.
 Blind-, Buried & Microvias
16/7/2025

SBU vs. HDI

Sequential multilayer assemblies (SBU) are usually connected directly to high-density printed circuit boards (HDI). Find out more about the connections, processes and possibilities of these two technologies.
SBU vs. HDI
22/4/2025

Leiton GmbH expands to India

New branch in Bangalore strengthens global supply chains and opens up access to high-tech suppliers
Leiton GmbH expands to India