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Leiton printed circuits | PCB | production | India | Multilayer | Flex

News, offers and useful information about Leiton PCBs

19/3/2026

Happy Ugadi

Wishing you and your Family a joyful and prosperous Ugadi!

 

 

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Happy Ugadi
9/3/2026

Celebrating One Year of Leiton India

We are proud to celebrate the first anniversary of Leiton India. A year marked by strong growth, strategic development, and successful collaboration. 

 

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Celebrating One Year of Leiton India
25/2/2026

Demand Up – Prices Down: India’s Prime PCB Online Platform Delivers More Value Than Ever

Leiton India continues its growth story with increasing demand, expanding customer partnerships, and enhanced automation.

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Demand Up – Prices Down: India’s Prime PCB Online Platform Delivers More Value Than Ever
26/1/2026

A Customer Success Story: How Leiton India Delivered a Cost-Optimized, High-Quality HDI PCB & PCBA

Leiton India successfully delivered a highly complex HDI PCB and PCBA solution, demonstrating how cost efficiency and high quality can be achieved simultaneously.

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A Customer Success Story: How Leiton India Delivered a Cost-Optimized, High-Quality HDI PCB & PCBA
26/1/2026

Leiton India: Your Partner for Complex PCBs – Complex HDI, Rigid-Flex, and Multi-Layer PCBs

In today’s fast-paced electronics market, product performance, miniaturization, and reliability depend heavily on the quality and complexity of the printed circuit board. 

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Leiton India: Your Partner for Complex PCBs – Complex HDI, Rigid-Flex, and Multi-Layer PCBs
14/1/2026

Our New Office

Just in time for the new year, our modern office in India is now fully equipped. Our team, which has already grown to ten employees in a very short time, is ready to get started.

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Our New Office
18/7/2025

Blind-, Buried & Microvias

VIAs (Vertical Interconnect Access) enable electrical connections between multiple copper layers of a printed circuit board (PCB). There are different types of VIAs with various advantages and disadvantages, which are selected according to the design requirements.

 Blind-, Buried & Microvias
16/7/2025

SBU vs. HDI

Sequential multilayer assemblies (SBU) are usually connected directly to high-density printed circuit boards (HDI). Find out more about the connections, processes and possibilities of these two technologies.
SBU vs. HDI
22/4/2025

Leiton GmbH expands to India

New branch in Bangalore strengthens global supply chains and opens up access to high-tech suppliers
Leiton GmbH expands to India