Special technologies | printed circuits | PCB | production | multilayer | Flex

Multilayers with up to 24 layers can be produced as quick-turn prototypes or are available for mass production. Hybrid stack-up, blind vias, 4mil structures, buried vias and copper-lid plugging for BGA components are possible in combination. Usually, such high-layer PCBs are produced with immersion gold finish (ENIG or ENEPIG).

Special stack-ups can contain a range of deviations from common printed circuit boards. Different materials can be combined in one stack-up (so-called "hybrids") or asymmetric stack-ups can be built. Even different copper thicknesses throughout the PCB are sometimes possible. We can prepare and send you possible stack-ups in advance.