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Leiton printed circuits | PCB | production | India | Multilayer | Flex

News, offers and useful information about Leiton PCBs

26/1/2026

A Customer Success Story: How Leiton India Delivered a Cost-Optimized, High-Quality HDI PCB & PCBA

Leiton India successfully delivered a highly complex HDI PCB and PCBA solution, demonstrating how cost efficiency and high quality can be achieved simultaneously. Through close collaboration with the customer during the early design phase, technical requirements were clearly defined while unnecessary costs were eliminated.

A key success factor was the optimization of the PCB design by modifying and eliminating unnecessary blind drills and simplifying the stack-up, drill sizes, and spacing. This was supported by a strong Design for Manufacturing (DFM) and Design for Assembly (DFA) approach, ensuring smooth, reliable, and cost-effective production.

For PCBA, Leiton India implemented automated assembly processes, strict quality controls, and comprehensive electrical and functional testing. This ensured high reliability, consistent quality, and robust performance, even for demanding applications.

The result is a cost-optimized HDI PCB and PCBA solution that meets high technical standards while remaining commercially competitive. This project highlights Leiton India’s capabilities as a trusted partner for innovative and high-quality electronics manufacturing.

A Customer Success Story: How Leiton India Delivered a Cost-Optimized, High-Quality HDI PCB & PCBA
26/1/2026

Leiton India: Your Partner for Complex PCBs – Complex HDI, Rigid-Flex, and Multi-Layer PCBs

In today’s fast-paced electronics market, product performance, miniaturization, and reliability depend heavily on the quality and complexity of the printed circuit board. As a trusted manufacturing partner, Leiton India specializes in complex PCB solutions, including advanced HDI, rigid-flex, and high-layer-count PCBs, tailored to meet demanding technical and commercial requirements.

Our expertise in HDI technology enables the realization of fine-line structures, microvias, and high-density interconnections that support compact, high-performance designs. For applications requiring flexibility and durability, our rigid-flex PCBs seamlessly combine rigid and flexible layers, reducing interconnects, saving space, and improving long-term reliability. In addition, our multi-layer PCB capabilities support complex routing, signal integrity, and power management for advanced electronic systems.

To reliably support these advanced technologies, Leiton India leverages a strong and well-established supplier database in Germany, India, and China. This global sourcing network enables access to specialized materials, advanced fabrication capabilities, and cost-efficient solutions to ensure optimal support for even the most complex PCB designs.

From early design support with DFM and DFA optimization to series production and testing, we work closely with customers at every stage of the project. State-of-the-art manufacturing processes, strict quality control, and reliable global supply chains ensure consistent quality, competitive costs, and on-time delivery.

Whether for industrial electronics, automotive systems, medical devices, or high-end consumer products, Leiton India is your reliable partner for complex PCB solutions: delivering innovation, quality, and scalability from prototype to mass production.

Leiton India: Your Partner for Complex PCBs – Complex HDI, Rigid-Flex, and Multi-Layer PCBs
14/1/2026

Our New Office

Just in time for the new year, our modern office in India is now fully equipped. Our team, which has already grown to ten employees in a very short time, is ready to get started. More space for ideas, faster coordination, and even more power for your projects! True to our motto: YOU DESERVE PCB+
Our New Office
18/7/2025

Blind-, Buried & Microvias

VIAs (Vertical Interconnect Access) enable electrical connections between multiple copper layers of a printed circuit board (PCB). There are different types of VIAs with various advantages and disadvantages, which are selected according to the design requirements.
 Blind-, Buried & Microvias
16/7/2025

SBU vs. HDI

Sequential multilayer assemblies (SBU) are usually connected directly to high-density printed circuit boards (HDI). Find out more about the connections, processes and possibilities of these two technologies.
SBU vs. HDI
22/4/2025

Leiton GmbH expands to India

New branch in Bangalore strengthens global supply chains and opens up access to high-tech suppliers
Leiton GmbH expands to India