| Name | Info | Version | Date | Type | Size | Download |
|---|---|---|---|---|---|---|
| Technology - Flexible Printed Circuits (94.34 KB, PDF) | 1.2-O | 26/5/2025 | 94.34 KB | |||
| Layer Stack-Ups - Flexible Circuit Boards - Rev 4.0 (82.44 KB, PDF) | 4.0-O | 24/11/2024 | 82.44 KB | |||
| Suggestions - Flexible Printed Circuits - Excess Length Design (124.21 KB, PDF) | 1.3-O | 27/1/2026 | 124.21 KB | |||
| Baking of Flexible- and Rigid-flexible Printed Circuits before Assembly (386.04 KB, PDF) | 1.3-O | 21/10/2024 | 386.04 KB |
Technology and design rules for flexible printed circuits
Downloads
Design Rules
| Options and Characteristics - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Quantity | 1 piece to 1 m² total area | from 1 piece to mass production |
| Number of layers | 1 to 2 layers | up to 6 layers |
| Material thickness | 65 µm or 45 µm respectively | 25 µm to 0.30 mm |
| Copper thickness (base) | 18 µm or 28~35 µm* *2layer standard starting from 18 µm base copper, plated up to ~28 µm |
5 µm, 9 µm, 12 µm, 18 µm, 28~35 µm* *2layer standard starting from 18 µm base copper, plated up to ~28 µm |
| Material colour | beige/fawn | beige/fawn |
| Base material | Polyimid with epoxy adhesive | adesive-less polyimide (PI), polyethylen (PET) |
| Operating temperature | around 120 °C | up to around 200 °C (Tg 260), adesive-less polyimide (PI) |
| Copper type | no selection | Elektrolytic deposit (ED) or rolled annealed (RA) |
| Silk print layer | none, Top | none, top, bottom, double sided |
| Solder mask colour | cover lay, yellow | green solder mask |
| Cover lay | yellow polyimide | yellow, black or white polyimide |
| Combination solder mask & cover lay | possible | possible |
| Silk print colour | white | black, blue, yellow, white, red |
| Via-Filling (no copper lid) | possible (with cover lay) | possible (with cover lay) |
| Stiffener | for standard ZIF/LIF connector 0.30 mm +/-0.05 mm | several thicknesses, FR4 or polyimide |
| 3M-adhesive | possible | possible |
| E-Test | possible | possible |
| Plugging Plugging (with copper lid, e.g. for „via-in-pad“ technology) | not possible | not possible |
| Peelable mask | not possible | possible (stiffeners) |
| Chamfering/beveling | not possible | not possible |
| Surface finish | i mmersion gold (ENIG) | i mmersion tin, i mmersion gold (ENIG), i mmersion silver, OSP |
| Connector gold plating | not possible | possible |
| Long term tempering | not possible | possible |
| Maximum FPC size 1 and 2 layers | 230x580 mm² | 230x580 mm² |
| Maximum FPC size 4 and 6 layers | not possible | 220x320 mm² |
| Lead time options 1- and 2 layers FPCs | 5WD, 7WD, 9WD, 12WD, 17WD, 22WD | from 3WD |
| Lead time options 4- and 6 layers FPCs | not possible | from 10WD |
| Routing | not possible | not possible |
| V-Cut / scoring | not possible | possible, inside fixture/stiffener |
| Jump scoring | not possible | not possible |
| Punching (soft tooling) | standard | possible |
| Punching (hard tooling) | not possible | possible |
| Hand Cut | not possible | possible |
| Hand cut & soft tooling combination | not possible | possible |
| Counter sink drills / tapped holes | not possible | not possible |
| Special multilayer stack-ups | not possible | possible |
| Panel production - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| V-Cut / scoring panel | not possible | possible |
| V-Cut - punching panel (combination) | not possible | possible |
| Multi Panel (more than one 1 layout on a panel) | not possible | possible |
| Panel setup (chosen by Leiton) | possible | possible |
| Panel setup (according to drawing) | not possible | possible |
| PTH-drills (plated drills) - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest Drill 5 µm to 18 µm (final diameter) | not possible | 0.15 mm |
| Smallest Drill 28~35 µm (final diameter) | 0.25 mm | 0.15 mm |
| Smallest Drill 70 µm (final diameter) | not possible | 0.20 mm |
| Smallest annular ring 5 µm to 18 µm | not possible | 0.10 mm |
| Smallest annular ring 28~35 µm | 0.15 mm | 0.10 mm |
| Smallest annular ring 70 µm | not possible | 0.15 mm |
| Possible drill sizes | up to 5.5 mm in 0.05 mm steps | up to 5.5 mm in 0.05 mm steps |
| drills >5.5 mm | punched | punched |
| Smallest hole-to-hole distance for 0.2 mm to 2.0 mm drill diameter (outer edge to outer edge) | 0.50 mm | 0.40 mm |
| Smallest hole-to-hole distance for 2.05 mm to 5.5 mm drill diameter (outer edge to outer edge) | 0.60 mm | 0.50 mm |
| Intersecting drills | not possible | replaced by punching |
| Half open drills on PCB edge (Half open PTH) | not possible | possible |
| NPTH-drills (non-plated drills) - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest drill size (final diameter) | 0.40 mm | 0.30 mm |
| Possible drill sizes | 0.40 mm to 5.5 mm in 0.05 mm steps | 0.30 mm to 5.5 mm in 0.05 mm steps |
| Copper clearance / distance to copper | 0.25 mm | 0.20 mm |
| Drills >5.5 mm | punched | punched |
| Smallest distance from drill to outer edge | 0.60 mm | 0.50 mm |
| Smallest hole-to-hole distance for 0.2 mm to 2.0 mm drill diameter (outer edge to outer edge) | 0.50 mm | 0.40 mm |
| mallest hole-to-hole distance for 2.05 mm to 5.5 mm drill diameter (outer edge to outer edge) | 0.60 mm | 0.50 mm |
| Intersecting drills | not possible | replaced by punching |
| NPTH drills in copper area (without clearance) | not possible (copper will be cleared by min. 0.25 mm) | on explicit notification |
| Blind Vias - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest blind via (final diameter) | not possible | 0.20 mm |
| Smallest Aspect-Ratio | not possible | 1 |
| Smallest annular ring | not possible | 0.15 mm |
| Buried Vias - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest buried via (final diameter) | not possible | 0.20 mm |
| Slots (non-plated) - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Inner slots NPTH | by punching or hand cut | Hard tool punching |
| Smallest inner slot NPTH | from 1.0 mm up, punching or by hand cut | from 0.5 mm up, hard tool punching |
| Smallest radius (inner corners) NPTH | right angle | acute angle |
| Slots (plated) - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Inner slots PTH | not possible | possible |
| Smallest inner slot PTH | not possible | from 0.5 mm hard tool punching |
| Edge plating (outer edge) | not possible | possible |
| Special outline paths with plating (inner) | not possible | possible |
| Smallest radius (inner corner, final) PTH | not possible | right angle |
| Smallest annular ring | not possible | 0.15 mm |
| Copper Layers (outer) - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest trace 5 µm | not possible | 0.03 mm |
| Smallest trace 9 µm | not possible | 0.06 mm |
| Smallest trace 18 µm | not possible | 0.09 mm |
| Smallest trace 28~35 µm | 0.10 mm oder 0.15 mm | 0.10 mm |
| Smallest trace 70 µm | not possible | 0.20 mm |
| Smallest trace-to-trace distance 18 µm | not possible | 0.09 mm |
| Smallest trace-to-trace distance 28~35 µm | 0.10 mm oder 0.15 mm | 0.10 mm |
| Smallest trace-to-trace distance 70 µm | not possible | 0.20 mm |
| Smallest drill-pad diameter | 0.55 mm | 0.40 mm |
| Smallest copper clearance to inner edges (slots) | 0.25 mm | 0.20 mm oder 0.0 mm (plated) |
| Smallest copper clearance to outer edges | 0.25 mm | 0.20 mm oder 0.0 mm (metallisiert) |
| Smallest copper clearance to outer edges (V-Cut) | not possible | 0.50 mm |
| Copper Layers (inner) - Multilayer Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest trace 5 to 9 µm | not possible | 0.04 mm |
| Smallest trace 18 µm | not possible | 0.09 mm |
| Smallest trace 28~35 µm | not possible | 0.10 mm |
| Smallest trace 70 µm | not possible | 0.20 mm |
| Smallest trace-to-trace distance 5 to 9 µm | not possible | 0.04 mm |
| Smallest trace-to-trace distance 18 µm | not possible | 0.09 mm |
| Smallest trace-to-trace distance 28~35 µm | not possible | 0.10 mm |
| Smallest trace-to-trace distance 70 µm | not possible | 0.20 mm |
| Smallest drill-pad diameter | not possible | 0.40 mm |
| Smallest copper clearance to outer edges | not possible | 0.30 mm |
| Smallest copper clearance to inner edges (slots) | not possible | 0.35 mm |
| Smallest copper clearance to drills | not possible | 0.30 mm |
| Solder Mask - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
 Smallest solder mask web (straight) |
0.10 mm | 0.10 mm |
 Smallest solder mask web (round) |
0.08 mm | 0.08 mm |
 Smallest size around copper pad |
0.05 mm | <0 mm |
| Smallest text lines | 0.25 mm | 0.25 mm |
| Cover Lay (punched / drilled / lasered) - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest rectangular pad (clearance) | 5x5 mm | 2x2 mm |
| Smallest cover lay web (straight) |
5.0 mm | 2.0 mm |
| Smallest cover lay web (round) |
3.0 mm | 1.0 mm |
| Smallest size around copper pad |
0.2 mm | <0 mm |
| Smallest text lines | not possible | not possible |
| Silk Print - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest lines | 0.20 mm | 0.15 mm |
| Smallest distance between lines | 0.20 mm | 0.15 mm |
| Minimum clearance to copper pads | 0.20 mm | 0.15 mm |
| Carbon Print - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest pad-to-pad distance | not possible | 0.50 mm |
| Tolerances, Values, Marks & Norms - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Max. offset drill centre to centre of reference | 0.10 mm | 0.075 mm |
| Max. offset solder stop (laquer or cover lay) / copper structures | 0.20 mm | 0.10 mm |
| Finished drill sizes PTH (up to 3 mm) | -0.05/+0.10 mm | -0/+0.10 mm |
| Finished drill sizes PTH (> 3 mm) | -0.05/+0.10 mm | -0/+0.10 mm |
| Finished drill sizes NPTH (up to 6 mm) | -0.05/+0.10 mm | -0/+0.10 mm |
| Finished drill sizes NPTH (>6 mm) | -0.05/+0.10 mm | -0/+0.10 mm |
| Outline | +/-0.30 mm | +/-0.10 mm |
| Max. offset outline/copper structures | +/-0.30 mm | +/-0.10 mm |
| Scoring depth | not possible | +/-0.20 mm |
| Max. offset scoring/copper structures | not possible | +/-0.20 mm |
| Etch tolerance copper thickness 5 µm | not possible | +0/-0.01 mm |
| Etch tolerance copper thickness 9 µm | not possible | +0/-0.01 mm |
| Etch tolerance copper thickness 18 µm | not possible | +0/-0.02 mm |
| Etch tolerance copper thickness 28~35 µm | +0/-0.03 mm | +0/-0.03 mm |
| Etch tolerance copper thickness 70 µm | not possible | +0/-0.04 mm |
| Material thickness tolerance | +/-15% | differs, please enquire |
| Copper thickness tolerance | +/-15% | +/-10% |
| Thickness i mmersion tin | >= 0.5 µm | >= 1.0 µm |
| Thickness tin (HAL-lead free) | not possible | nicht möglich |
| I mmersion gold for soldering purpose (nickel thickness) | 1.5 µm to 3 µm | 2.5 µm to 5 µm |
| I mmersion gold for soldering purpose (gold thickness) | 0.025 µm to 0.075 µm | 0.05 µm to 0.075 µm |
| I mmersion gold for gold-wire bonding (nickel thickness) | not possible | not possible |
| I mmersion gold for gold-wire bonding (gold thickness) | not possible | not possible |
| I mmersion gold for aluminium-wire bonding (nickel thickness) | 1.5 µm to 3 µm | 2.5 µm to 5 µm |
| I mmersion gold for aluminium-wire bonding (gold thichicht) | 0.025 µm to 0.075 µm | 0.05 µm to 0.075 µm |
| Elctrolytic soft gold for connectors, soft, bonding (nickel thickness) | not possible | 4 µm to 8 µm |
| Elctrolytic soft gold for connectors, soft, bonding (gold thickness) | not possible | 0.2 µm to 0.3 µm |
| Elctrolytic hard gold for connectors, hard, no bonding (nickel thickness) | not possible | 4 µm to 8 µm |
| Elctrolytic hard gold for connectors, hard, no bonding (gold thickness) | not possible | 0.8 µm to 1 µm |
| Solder mask thickness | ca. 10 µm | >15 µm |
| Cover lay thickness | 25.4 µm | from 12.5 µm |
| Adhesive thickness Polyimid base material to copper (epoxy) | 25.4 µm | from 12.5 µm |
| Adhesive thickness Polyimid-cover lay to copper | 25.4 µm | from 12.5 µm |
| Copper thickness inside plated holes (PTH) 5 µm to18 µm | at least 6 µm | at least 6 µm |
| Copper thickness inside plated holes (PTH) 28~35 µm | at least 10 µm | at least 10 µm |
| Copper thickness inside plated holes (PTH) 70 µm | at least 12 µm | at least 12 µm |
| Connector tolerance with siffener (total width) | +/-0.15 mm | +/-0.075 mm |
| Connector tolerance with siffener (outline to pad) | +/-0.15 mm | +/-0.075 mm |
| Chamfer angle | not possible | not possible |
| Base material RoHS-compliant | yes alway | yes alway |
| Surface finish RoHS-compliant | yes alway | yes alway |
| IPC-norm | some | IPC-6013 - Class 1. 2 or 3 |
| UL-certification of FPC (UL-number, Logo, datecode) | not possible | possible |
| UL-certification of FPC base material | some | possible |
| Insert date code (WW/YY) | possible, please advise in case of order/enquiry | possible, please advise in case of order/enquiry |
| Insert supplier logo (Leiton) | possible, please advise in case of order/enquiry | possible, please advise in case of order/enquiry |
| DIN EN ISO 9001 certification for order preparation, CAM and order processing from Leiton | yes | yes |
| DIN EN ISO 9001 certification FPC supplier | yes | yes |
| DIN EN ISO 14001 certification FPC supplier | no | possible |
| DIN EN ISO 16949 certification FPC supplier | no | possible |