| Name | Info | Version | Date | Type | Size | Download |
|---|---|---|---|---|---|---|
| Technology - Rigid Flexible Printed Circuits (92.5 KB, PDF) | 1.2-O | 26/5/2025 | 92.5 KB | |||
| Stackup SF A1 2-layer - Standard online calculation (19.31 KB, PDF) | 3.0 | 14/11/2024 | 19.31 KB | |||
| Stackup SF A1 4-layer - Standard online calculation (44.1 KB, PDF) | 3.0 | 14/11/2024 | 44.1 KB | |||
| Stackup SF A1 6-layer - Standard online calculation (45.43 KB, PDF) | 3.0 | 14/11/2024 | 45.43 KB |
Technology and design rules for rigid flexible printed circuits
Downloads
Design Rules
| Options and characteristics - rigid-flexible printed circuits | Online calculation/Standard | On explicit enquiry |
|---|---|---|
| Quantities | 1 piece to max. 0.4 m² total area | 1 piece to mass prodcuction |
| Layer count (total) | 2-, 4- and 6-layers | up to 12 layers |
| Layer count (flexible) | 2-, 4- und 6-Lagen | up to 4 layer |
| Flex layer position | outer | outer and inner |
| Material thickness | 1.2 / 1.6 / 2.0 mm | 0.5 to 3.2 mm |
| Kupferdicke (Basis) | 35 µm | 35 / 70 µm |
| Material color | beige / red-brown (oolyimide) | beige / red-brown (polyimide) |
| Base material type | FR4 with oolyimide and epoxy adhesive | FR4 with polyimide and epoxy adhesive |
| Maximum operating temeprature | ca. 120 °C | ca. 120 °C |
| Copper type | no selection | ED- or RA-copper |
| Silk print layers | none, top, bottom, double-sided | none, top, bottom, double-sided |
| Solder mask colors | green | yellow, green, white, red, blue, black |
| Cover-lay | yellow polyimide |
yellow, black or white polyimide |
| Combination of cover-lay and solder mask | possible | possible |
| Sil print color | white | white, black, blue, yellow, green, red |
| Via-filler (no copper-lid) | possible by cover-lay | possible by cover-lay |
| Stiffener | possible | variety of thicknesses, FR4 or polyimide, standard ZIF/LIF connectors 0.30 mm +/-0.05 mm |
| 3M-adhesive | not possible | possible |
| Electrical test | possible | not possible |
| Plugging (with copper-lid, e.g. for "via-in-pad") | not possible | possible with inner-flex-layers |
| Peelable mask | not possible | possible |
| Beveling | not possible | possible (rigid area) |
| Surface finish | i mmersion gold ENIG | i mmersion gold ENIG or ENEPIG |
| Connector gold | not possible | possible |
| Long term baking | not possible | possible |
| Maximum PCB size 2-layer | 235x370m m² | depends on specifications, please enquire |
| Maximum PCB size 4- and 6-layer | 235x370m m² | depends on specifications, please enquire |
| Lead time options 2-layer | 10WD, 15WD, 20WD | <10WD |
| Lead time options 4- and 6-layer | 10WD, 15WD, 20WD | <10WD |
| Routing | included | included |
| V-cut | not possible | possible, in rigid area |
| Jump v-cut | not possible | possible, in rigid area |
| Punching | not possible | not possible |
| Counter-sink drills | not possible | possible |
| Special multilayer stack-ups | not possible | possible |
| Panelization - rigid-flexible printed circuits | Online calculation/Standard | On explicit enquiry |
|---|---|---|
| V-cut-panel | not possible | possible |
| V-cut-punching-panel | not possible | not possible |
| Multy-panel (more than 1 layout) | not possible | possible |
| Panelization (chosen by Leiton) | possible | possible |
| Panelization (according to drawing, prepared by Leiton) | possible | possible |
| PTH-Drills (plated) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Smallest drill | 0.30 mm | 0.20 mm |
| Smallest annular ring | 0.15 mm | 0.10 mm |
| Drill sizes | up to 5.5 mm in 0.05 mm steps | up to 5.5 mm in 0.05 mm steps |
| Drills >5.5 mm | routing | routing |
| Min. hole distance 0.2 mm to 2.0 mm drill diameter | 0.50 mm | 0.40 mm |
| Min. hole distance 2.05 mm to 5.5 mm drill diameter | 0.60 mm | 0.50 mm |
| Min. distance PTH-drill to flexible layer | 1.00 mm | 0.80 mm |
| Intersecting drills | not possible | not possible |
| Half-open PTH | not possible | not possible |
| PTH in flexible area | not possible | possible |
| NPTH-Drills (non-plated) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Smallest drill | 0.30 mm | 0.20 mm |
| Drill sizes | 0.30 mm to 5.5 mm in 0.05 mm steps | 0.20 mm to 5.5 mm in 0.05 mm steps |
| Distance to copper areas | 0.25 mm | 0.20 mm |
| Drills >5.5 mm | routing | routing |
| Min. distance to outline | 0.60 mm | 0.50 mm |
| Min. hole distance 0.2 mm to 2.0 mm drill diameter | 0.50 mm | 0.40 mm |
| Min. hole distance 2.05 mm to 5.5 mm drill diameter | 0.60 mm | 0.50 mm |
| Intersecting drills | not possible | nicht möglich |
| NPTH in copper areas | not possible(0.2 mm clearance will be applied) | on explicit enquiry |
| Blind vias - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Smallest blind via (final) | not possible | 0.10 mm |
| Smallest aspect-ratio | not possible | 1:1 |
| Smallest annular ring | not possible | 0.15 mm |
| Buried vias - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Smallest buried via | not possible | 0.10 mm |
| Slots (non-plated) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Inner routing / slots (NPTH) | possible | possible |
| Smallest routing / slots (NPTH) | from 1.0 mm up | from 0.6 mm up |
| Smallest routing radious (NPTH) | 0.5 mm | 0.3 mm |
| Slots (plated) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Plated slots (PTH) | not possible | possible |
| Smallest plated slot | not possible | from 0.7 mm |
| Plated outline | not possible | not possible |
| Special slot shapes, plated (inner) | not possible | possible |
| Smallest radius, plated | not possible | 0.3 mm |
| Smallest annular ring | not possible | 0.15 mm |
| Copper layers (outer) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Smallest trace width 35 µm | 0.15 mm | 0.10 mm |
| Smallest trace width 70 µm | not possible | 0.20 mm |
| Smallest trace distance 35 µm | 0.15 mm | 0.10 mm |
| Smallest trace distance 70 µm | not possible | 0.20 mm |
| Smallest drill-pad | 0.60 mm | 0.50 mm |
| Smallest clearance to inner slots | 0.25 mm | 0.20 mm or 0.0 mm (plated) |
| Smallest clearance to outline | 0.25 mm | 0.20 mm or 0.0 mm (plated) |
| Copper layers (outer) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Smallest trace width 35 µm | not possible | 0.10 mm |
| Smallest trace width 70 µm | not possible | 0.20 mm |
| Smallest trace distance 35 µm | not possible | 0.10 mm |
| Smallest trace distance 70 µm | not possible | 0.20 mm |
| Smallest drill-pad | not possible | 0.40 mm |
| Smallest clearance to inner outline | not possible | 0.30 mm |
| Smallest clearance to inner slots | not possible | 0.35 mm |
| Smallest clearance to inner drills | not possible | 0.30 mm |
| Solder mask - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
 Smallest solder mask bridge (straight) |
0.10 mm | 0.08 mm |
 Smallest solder mask bridge (round) |
0.05 mm | 0.05 mm |
 Smallest clearance |
0.05 mm | <0 mm |
| Smallest text size | 0.25 mm | 0.25 mm |
| Cover-lay (punched / drilled / lasered) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Smallest rectangular pad | 5x5 mm | 2x2 mm |
| Smallest web bridge (rectangular) |
5.0 mm | 2.0 mm |
| Smallest web bridge (round) |
3.0 mm | 1.0 mm |
| Smallest clearance |
0.2 mm | <0 mm |
| Smallest text size | not possible | not possible |
| Silk print - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Smallest text size | 0.20 mm | 0.15 mm |
| Smallest text distance | 0.20 mm | 0.15 mm |
| Minimum clearance to pads | 0.20 mm | 0.15 mm |
| Carbon print - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Minimum pad distance | not possible | 0.50 mm |
| Tolerances, values, markings & standards - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Max. deviation between centre of drill and target | 0.10 mm | 0.075 mm |
| Max. offset solder mask to copper | 0.20 mm | 0.10 mm |
| Drill diameter PTH (<=3 mm) | -0.05/+0.10 mm | -0/+0.10 mm |
| Drill diameter PTH (>3 mm) | -0.05/+0.10 mm | -0/+0.10 mm |
| Drill diameter NPTH (<=6 mm) | -0.05/+0.10 mm | -0/+0.10 mm |
| Drill diameter NPTH (>6 mm) | -0.05/+0.10 mm | -0/+0.10 mm |
| Outline | +/-0.30 mm | +/-0.10 mm |
| Max. offset copper to outinline | +/-0.30 mm | +/-0.10 mm |
| V-cut depth | not possible | +/-0.20 mm |
| Max. offset v-cut to copper | not possible | +/-0.20 mm |
| Etching tolerance (trace width) 35 µm | +0/-0.03 mm | +0/-0.03 mm |
| Etching tolerance (trace width) 70 µm | not possible | +0/-0.04 mm |
| Material thickness tolerance | +/-15% | varies, please enquire |
| Copper thickness tolerance | +/-15% | +/-10% |
| I mmersion tin thickness | not possible | not possible |
| HAL lead-free thickness | not possible | not possible |
| I mmersion gold, ENIG (nickel thickness) | 2.5 µm to 5 µm | 2.5 µm to 5 µm |
| I mmersion gold, ENIG (gold thickness) | 0.025 µm to 0.075 µm | 0.05 µm to 0.075 µm |
| I mmersion gold, ENEPIG (nickel thickness) | not possible | 2.5 µm to 5 µm |
| I mmersion gold, ENEPIG (gold thickness) | not possible | 0.025 µm to 0.05 µm |
| Elect. gold - soft, bonding (nickel thickness) | not possible | not possible |
| Elect. gold - soft, bonding (gold thickness) | not possible | not possible |
| Elect. connector gold - hard, no bonding (nickel thickness) | not possible | 4 µm to 8 µm |
| Elect. connector gold - hard, no bonding (gold thickness) | not possible | 0.8 µm to 1.2 µm |
| Solder mask thickness | ca. 10 µm | >15 µm |
| Cover-lay thickness | 25.4 µm | ab 12.5 µm |
| Thickness of adhesive polyimide-basefilm to copper (epoxy) | 25.4 µm | ab 12.5 µm |
| Thickness of adhesive polyimide-cover-lay to copper (epoxy) | 25.4 µm | ab 12.5 µm |
| Copper wall 35 µm | min. 18 µm | min. 20 µm |
| Copper wall 70 µm | not possible | min. 20 µm |
| Connector tolerance with stiffener (total width) | not possible | +/-0.10 mm |
| Connector tolerance with stiffener (pad to outline) | not possible | +/-0.10 mm |
| Beveling angle | not possible | 45° / 60° |
| Base material RoHS-complian | yes, always | yes, always |
| Surface finish RoHS-complian | yes, always | yes, always |
| IPC-standard | class 2 | IPC-6013 - class 1. 2 or 3 |
| UL-approval of RFPCB (UL-number, logo, date code) | not possible | not possible |
| UL-approval of base materials | possible | possible |
| Adding date code (WW/YY) | possible, please mention in co mments | possible, please mention in co mments |
| Adding company logo (Leiton) | possible, please mention in co mments | possible, please mention in co mments |
| DIN EN ISO 9001 certification of Leiton GmbH | yes | yes |
| DIN EN ISO 14001 certification of Leiton GmbH | no | possible |
| DIN EN ISO 16949 certification | no | possible |