| Name | Info | Version | Date | Type | Size | Download |
|---|---|---|---|---|---|---|
| Design Guide for Drills (94.1 KB, PDF) | 2.1-O | 25/2/2025 | 94.1 KB | |||
| Technology - Rigid Printed Circuits (97.59 KB, PDF) | 1.2-O | 26/5/2025 | 97.59 KB | |||
| Layer Stack-ups - Rigid FR4 Circuit Boards - Rev 7.0 (184.85 KB, PDF) | 7.0 | 14/11/2024 | 184.85 KB | |||
| Tenting, Plugging and Filling Information (641.27 KB, PDF) | 1.2-O | 21/12/2021 | 641.27 KB |
Design Rules for Rigid Printed Circuits - PCB
Downloads
Design Rules
| Options and Characteristics - Rigid Printed Circuits - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Quantity | 1 piece up to 2.5 m² total area | from 1 piece up to mass production with on-call orders |
| Layer quantity | 1 to 14 layers | up to 24 layers |
| Material thickness (1 and 2 layers) | 0.5 mm; 0.8 mm; 1.0 mm; 1.2 mm; 1.55 mm; 2.0 mm and 2.4 mm | 0.10 mm* to 3.0 mm *see flexible printed circuits (FPC) |
| Material thickness (up to 14 layers multilayer) | several, up to 2.4 mm | 0.2 mm* to 4.2 mm *see flexible printed circuits (FPC) |
| Copper thickness (1 and 2 layers) | 35 µm, 70 µm and 105 µm | 35 µm, 70 µm, 105 µm, 140 µm, 210 µm, 280 µm, 400 µm |
| Copper thickness (up to 14-layer multilayers) | 35 µm, partially 70 µm and 105 µm | 12 µm to 210 µm |
| Material colour | beige / fawn | black, blue, white |
| Base material type | FR4 Tg 130°C; FR4 Tg 170°C | several Rogers HF, Isola high-Tg etc. (please enquire our stock) |
| Maximum operating temperature | ca. 110°C / ca. 150°C | up to ca. 230°C (Tg 260) |
| Minimum operating temperature | ca. -40°C | down to ca. -40°C |
| Silk print layer | none, top, bottom, double sided | none, top, bottom, double sided |
| Solder mask colour | green, white, black, blue, red | green, white, black, blue, red and transparent (individual colours on exact colour value - RAL scale) |
| Silk print colour | white | black, blue, yellow, red |
| Via-Filling (no copper lid) | possible | possible |
| Electric test | possible (flying probe) | possible, also adapter |
| Plugging (with copper lid, e.g. for "via-in-pad technology" | possible | possible |
| Peelable mask | top, bottom or double sided | top, bottom or double sided |
| Bevelling | possible | possible |
| Surface finish | HAL lead free, i mmersion tin, i mmersion gold (ENIG and ENEPIG), RoHS compliant (means one of the three surface finishs, chosen by Leiton) | HAL lead free, i mmersion tin, i mmersion gold (ENIG and ENEPIG), OSP (ENTEK), i mmersion silver, HAL lead, RoHS compliant (means one of the three surface finishs, chosen by Leiton) |
| Connector gold | possible | possible |
| Long term tempering | not possible | possible |
| Maximum printed circuit board size 1 and 2 layers PCB | 570 x 500 mm² (prototypes), 537x437 mm² (M-series) | 1200 x 500 mm² |
| Maximum printed circuit board size for multilayer PCBs | 570 x 500 mm² (prototypes), 537x437 mm² (M-series) | 500 x 600 mm² |
| Minimum singulated circuit board size | 3cm², smaller can be calculated but will be paneliyed | >1cm² <3cm² on enquiry |
| Minimum circuit board size in v-cut panels | 5 x 5 mm² | |
| Minimum circuit boar size in routing panels | 10 x 10 mm², bzw. 1cm² | |
| Minimum printed circuit board width | 5 mm | |
| Lead time options 1 and 2 layers printed circuits | 2WD, 3WD, 5WD, 7WD, 8WD, 9WD, 12WD, 15WD, 18WD, 25WD | In-day-service and over-night-service |
| Lead time options 4 to 8 layers multilayer printed circuits | 3WD, 4WD, 6WD, 7WD, 9WD, 10WD, 12WD, 15WD, 18WD, 25WD | Over-night-service |
| Lead time options 10 to 14 layers multilayer printed circuits | 4WD, 5WD, 8WD, 12WD | from 2WD |
| Lead time options 16 to 24 layers multilayer printed circuits | not possible | from 3WD |
| Routing | always | always, except punching |
| V-cut | possible | possible |
| Jump-v-cut | possible | possible |
| Punching | not possible | possible |
| Counter-sink-holes | not possible | possible |
| Z-axis milling | not possible | possible |
| Multilayer special stack-up | not possible | possible |
| Panel Production - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| V-cut panel | possible | possible |
| V-Cut - Routing panel (combination) | possible | possible |
| Multi panels (more than one layout per panel) | possible | possible |
| Panel setup (chosen by Leiton) | possible | possible |
| Panel setup (according to drawing) | possible | possible |
| PTH-drills (plated drills) - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest drill 35 µm (final diameter) | 0.10 mm, standard is 0.30 mm | 0.10 mm |
| Smallest drill 70 µm (final diameter) | 0.10 mm | 0.10 mm |
| Smallest drill 105 µm (final diameter) | 0.10 mm | 0.10 mm |
| Smallest drill 140 µm (final diameter) | not possible | 0.30 mm |
| Smallest drill 210 µm (final diameter) | not possible | not possible |
| Smallest drill 280 µm (final diameter) | not possible | 0.40 mm |
| Smallest drill 400 µm (final diameter) | not possible | 0.50 mm |
| Smallest annular ring 35 µm | 0.15 mm | 0.10 mm |
| Smallest annular ring 70 µm | 0.15 mm | 0.12 mm |
| Smallest annular ring 105 µm | 0.20 mm | 0.15 mm |
| Smallest annular ring 140 µm | not possible | 0.25 mm |
| Smallest annular ring 210 µm | not possible | 0.30 mm |
| Smallest annular ring 280 µm | not possible | 0.40 mm |
| Smallest annular ring 400 µm | not possible | 0.50 mm |
| Possibel drill diameters | 0.20 mm to 5.5 mm in 0.05 mm steps | 0.15 mm to 5.5 mm in 0.05 mm steps |
| Drills >5.5 mm | are routed | are routed |
| Smallest drill distance 0.20 mm to 2.00 mm hole size (drill edge to drill edge) | 0.40 mm | 0.40 mm |
| Smallest drill distance 2.05 mm to 5.50 mm hole size (drill edge to drill edge) | 0.50 mm | 0.20 mm |
| Intersecting drills | not possible, will be routed | 1.0 mm to 2.0 mm |
| Half-open PTH on PCB edge | possible | possible |
| NPTH-drills (non-plated drills) - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest drill size (final diameter) | 0.60 mm | 0.30 mm |
| Possible drill sizes | 0.60 mm to 5.5 mm in 0.05 mm steps | 0.15 mm to 5.5 mm in 0.05 mm steps |
| Copper clearance / distance to copper | 0.20 mm | 0.20 mm |
| Drills >5.5 mm | are routed | are routed |
| Minimum drill-to-edge distance | 0.50 mm | 0.50 mm |
| Smallest drill distance 0.20 mm to 2.00 mm hole size (drill edge to drill edge) | 0.40 mm | 0.20 mm |
| Intersecting drills | not possible, will be routed | 1.0 mm to 2.0 mm |
| NPTH drills in copper area (without clearance) | not possible (will be cleared from copper by min. 0.2 mm) | on explicit requirement only |
| Blind Vias - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest blind via (final diameter) | 0.30 mm to 0.50 mm, depending on stack-up and required layer connection | 0.30 mm |
| Smallest Aspect-Ratio | 1 | 1 |
| Smallest annular ring | 0.15 mm | 0.125 mm |
| Buried Vias - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest buried via (final diameter) | 0.30 mm | 0.10 mm |
| Routing (non-plated) - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Inner routing NPTH | possible | possible |
| Smallest inner routing NPTH | 0.70 mm | 0.60 mm (depends on PCB thickness) |
| Available routing diameters NPTH | up to 2.0 mm in 0.10 mm steps | up to 2.2 mm in 0.10 mm steps |
| Smallest radius (inner corners) NPTH | 0.35 mm | 0.35 mm |
| Routing (plated) - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Inner routing PTH | partly possible | possible |
| Smallest inner routing PTH (final diameter) | 0.60 mm | 0.50 mm (depends on PCB thickness) |
| Edge plating (outer edge) | not possible | possible |
| Special routing paths with plating (inner) | partly possible | possible |
| Available routing diameters PTH (final diameter) | up to 1.9 mm in 0.10 mm steps | up to 1.9 mm in 0.10 mm steps |
| Smallest radius (inner corner, final) PTH | 0.30 mm | 0.30 mm |
| Smallest annular ring | 0.20 mm | 0.20 mm |
| Copper Layers (outer) - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest trace 18 µm | not possible | 0.07 mm |
| Smallest trace 35 µm | 0.10 mm; 0.125 mm or 0.15 mm | 0.08 mm |
| Smallest trace 70 µm | 0.20 mm | 0.15 mm |
| Smallest trace 105 µm | 0.25 mm | 0.20 mm |
| Smallest trace 140 µm | not possible | 0.30 mm |
| Smallest trace 210 µm | not possible | 0.60 mm |
| Smallest trace 280 µm | not possible | 0.80 mm |
| Smallest trace 400 µm | not possible | 1.20 mm |
| Smallest trace-to-trace distance 18 µm | not possible | 0.09 mm |
| Smallest trace-to-trace distance 35 µm | 0.10 mm; 0.125 mm or 0.15 mm | 0.10 mm |
| Smallest trace-to-trace distance 70 µm | 0.20 mm | 0.15 mm |
| Smallest trace-to-trace distance 105 µm | 0.25 mm | 0.20 mm |
| Smallest trace-to-trace distance 140 µm | not possible | 0.40 mm |
| Smallest trace-to-trace distance 210 µm | not possible | 0.60 mm |
| Smallest trace-to-trace distance 280 µm | not possible | 0.70 mm |
| Smallest trace-to-trace distance 400 µm | not possible | 0.80 mm |
| Smallest drill pad | 0.50 mm bei 0.20 mm Bohrungen, Standard ist 0.60 mm | 0.38 mm |
| Smallest copper clearance to inner routing | 0.25 mm | 0.15 mm or 0.0 mm (plated) |
| Smallest copper clearance to board edge (routing) | 0.25 mm | 0.15 mm or 0.0 mm (plated) |
| Smallest copper clearance to board edge (v-cut) | 0.40 mm | 0.30 mm |
| Copper Layers (inner) - Rigid Multilayer Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest trace 18 µm | not possible | 0.08 mm |
| Smallest trace 35 µm | 0.10 mm; 0.125 mm or 0.15 mm | 0.10 mm |
| Smallest trace 70 µm | 0.20 mm | 0.15 mm |
| Smallest trace 105 µm | 0.25 mm | 0.25 mm |
| Smallest trace-to-trace distance 18 µm | not possible | 0.08 mm |
| Smallest trace-to-trace distance 35 µm | 0.10 mm; 0.125 mm or 0.15 mm | 0.08 mm |
| Smallest trace-to-trace distance 70 µm | 0.20 mm | 0.15 mm |
| Smallest trace-to-trace distance 105 µm | 0.25 mm | 0.20 mm |
| Smallest drill-pad diameter | 0.60 mm | 0.40 mm |
| Smallest copper clearance to outer edges (routed) | 0.30 mm | 0.25 mm |
| Smallest copper clearance to inner edges (routed) | 0.30 mm | 0.25 mm |
| Smallest copper clearance to drills | 0.30 mm | 0.25 mm |
| Solder Mask - Rigid Multilayer Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
 Smallest solder mask web (green, straight) |
0.12 mm | 0.10 mm |
| Smallest solder mask web (non-green, straight) |
0.15 mm | 0.15 mm |
 Smallest solder mask web (round) |
0.075 mm | 0.05 mm |
 smallest solder mask size around copper |
0.075 mm | <0 mm |
| Smallest text lines | 0.25 mm | 0.20 mm |
| Silk Print - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest lines | 0.20 mm | 0.15 mm |
| Smallest distance between lines | 0.20 mm | 0.15 mm |
| Minimum clearance to copper pads | 0.20 mm | 0.15 mm |
| Carbon Print - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest pad-to-pad distance | not possible | 0.50 mm |
| Tolerances, Values, Marks & Norms - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Max. offset drill centre to centre of reference | 0.07 mm | 0.05 mm |
| Max. offset solder mask / copper structures | 0.12 mm | 0.075 mm |
| Finished drill sizes PTH (up to 3 mm) | +/-0.10 mm | +/-0.05 mm |
| Finished drill sizes PTH (>3 mm <5.5 mm) | +/-0.12 mm | +/-0.10 mm |
| Finished drill sizes NPTH (up to 5.5 mm) | +/-0.12 mm | +/-0.075 mm |
| Finished drill sizes PTH & NPTH (>5.5 mm - routed) | +/-0.20 mm | +/-0.125 mm |
| Outline | +/-0.20 mm | +/-0.125 mm |
| Max. offset outline/copper structures | +/-0.15 mm | +/-0.10 mm |
| V-cut depth | +/-0.30 mm | +/-0.20 mm |
| Z-axis milling | not possible | +/-0.05 mm |
| V-Cut position to copper structures | +/-0.25 mm | +/-0.15 mm |
| Etch tolerance copper thickness 18 µm | not possible | +0/-0.02 mm |
| Etch tolerance copper thickness 35 µm | +0/-0.03 mm | +0/-0.03 mm |
| Etch tolerance copper thickness 70 µm | +0/-0.05 mm | +0/-0.05 mm |
| Etch tolerance copper thickness 105 µm | +0/-0.07 mm | +0/-0.07 mm |
| Etch tolerance copper thickness 140 µm | not possible | +0/-0.10 mm |
| Etch tolerance copper thickness 210 µm | not possible | +0/-0.12 mm |
| Etch tolerance copper thickness 280 µm | not possible | +0/-0.12 mm |
| Etch tolerance copper thickness 400 µm | not possible | +0/-0.25 mm |
| Material thickness tolerances | <=1.0 mm: +/-15% >1.0 mm: +/-10% 1.55 mm: 1.6 mm +/-10% |
differs, please enquire |
| Copper thickness tolerances | +20% / -15% | +/-10% |
| I mmersion tin thickness | >=0.7 µm | >=1.0 µm |
| HAL lead free thickness | >= 8- to 10 µm, Kanten >0.5 µm | >= 8- to 10 µm, Kanten >0.5 µm |
| HAL lead thickness | not possible | >= 8- to 10 µm, edges >0.5 µm |
| ENIG - I mmersion gold for soldering (nickel thickness) | 2.5 µm to 5 µm | 3 µm to 6 µm |
| ENIG - I mmersion gold for soldering (gold thickness) | 0.05 µm to 0.075 µm | 0.07 µm to 0.12 µm |
| ENEPIG - I mmersion nickel-palladium-gold for gold-wire bonding (nickel thickness) | 4 µm to 8 µm | 4 µm to 8 µm |
| ENEPIG - i mmersion nickel-palladium-gold for for gold-wire bonding (palladium thickness) | 0.1 µm to 0.3 µm | 0.1 µm to 0.3 µm |
| ENEPIG - imersion nickel-palladium-gold for gold-wire bonding (gold thickness) | 0.02 µm to 0.08 µm | 0.02 µm to 0.08 µm |
| I mmersion gold for gold-wire bonding (nickel thickness) | not possible | 3 µm to 6 µm |
| I mmersion gold for gold-wire bonding (gold thickness) | not possible | 0.4 µm to 6 µm |
| I mmersion gold for aluminum-wire bonding (nickel thickness) | 2.5 µm to 5 µm | 3 µm to 6 µm |
| I mmersion gold for aluminum-wire bonding (gold thickness) | 0.05 µm to 0.075 µm | 0.07 µm to 0.12 µm |
| Electrolytic connector gold - soft, bonding possible (nickel thickness) | not possible | 4 µm to 8 µm |
| Electrolytic connector gold - soft, bonding possible (gold thickness) | not possible | 0.3 µm to 5 µm |
| Electrolytic connector gold - hard, bonding NOT possible (nickel thickness) | 4 µm to 8 µm | 4 µm to 8 µm |
| Electrolytic connector gold - hard, bonding NOT possible (gold thickness) | 1.0 µm | 0.8 µm to 5 µm |
| Wet solder laquer thickness | >15 µm | >15 µm |
| Copper thickness in plated hole, traces 35 µm | minimum 20 µm | minimum 20 µm |
| Copper thickness in plated hole, traces 70 µm or 105 µm | minimum 20 µm | minimum 20 µm |
| Copper thickness in plated hole, traces 140 to 210 µm | not possible | mindestens 25 µm |
| Copper thickness in plated hole, traces 280 to 400 µm | not possible | minimum 30 µm |
| Winding | max. 1% | max. 0.5% |
| Warping | max. 1% | max. 0.5% |
| Bevelling angle | 30°, 45°, 60° | 30°, 45°, 60° |
| Base materials RoHS-compliance | yes, always | yes, always |
| Surface finish RoHS-compiance | yes, always | always, unless "HAL lead" is explicitly required |
| IPC-norm | IPC-A-600 - Class 2 | IPC-A-600 - Class 1. 2 or 3 |
| UL-approval of printed circuits (UL number, logo, date code) | UL94-V0 possible | UL94-V0 possible |
| UL-approved base material | yes, always | possible |
| Insertion of date code | possible, please mention in enquiry | possible, please mention in enquiry |
| Insertion of supplier logo (Leiton) | possible, please mention in enquiry | possible, please mention in enquiry |
| DIN EN ISO 9001 certification of printed circuit board production | yes | yes |
| DIN EN ISO 14001 certification of printed circuit board production | yes | yes |
| DIN EN ISO 16949 certification of printed circuit board production | no | possible |