| Name | Info | Version | Date | Type | Size | Download |
|---|---|---|---|---|---|---|
| Technology - HF-Printed Circuits (92.62 KB, PDF) | - | 25/8/2025 | 92.62 KB | |||
| Datasheet - Rogers RO4360G2 - Rev 1.0 (86.76 KB, PDF) | 1.0 | 17/7/2020 | 86.76 KB | |||
| Datasheet - Rogers RO4003C and RO4350B - Rev 1.0 (233.19 KB, PDF) | 1.0 | 16/10/2014 | 233.19 KB |
Design Rules for Rogers 4000 HF Printed Circuits
Downloads
Design Rules
| Options and Characteristics - Rigid Printed Circuits - PCBs | Online calculation//Standard | on explicit enquiry |
|---|---|---|
| Quantity | 1 piece up to 0.4 m² total area | from 1 piece |
| Layer quantity | 1 to 2 layers | up to 8 layers |
| Materialdicke RO4003C (1- and 2 layers) |
0.203 mm, 0.3 mm; 0.41 mm; 0.51 mm; 0.81 mm; 1.524 mm; | 0.203 mm; 0.305 mm; 0.406 mm; 0.508 mm; 0.813 mm; 1.524 mm |
| Materialdicke RO4350B (1- und 2 layers) |
0.168 mm; 0.254 mm; 0.508 mm; 0.762 mm; 1.524 mm | 0.168 mm; 0.254 mm; 0.338 mm; 0.422 mm; 0.508 mm; 0.762 mm; 1.524 mm |
| Materialdicke Panasonic Megtron6 (1- und 2 layers) |
0.25 mm; 0.74 mm; 1.46 mm | 0.15 mm; 0.20 mm; 0.30 mm; 0.40 mm; 0.50 mm; 0.925 mm |
| Material thickness (4. 6 and 8 layers) | not possible | with above mentioned cores up to 4.0 mm |
| Copper thickness (1 and 2 layers) | 35 µm | 35 µm, 70 µm |
| Copper thickness (4. 6 and 8 layers) | not possible | outer: 35 µm, 70 µm / inner: 18 µm, 35 µm |
| Material colour | white | white |
| Maximum operating temperature (Rogers) | ca. 280 °C | ca. 280 °C |
| Maximum operating temperature (Megtron6) | ca. 170 °C (TG 185 °C) | ca. 170 °C (TG 185 °C) |
| Minimum operating temperature | ca. -40 °C | ca. -40 °C |
| Silk print layer | none, top, bottom, double sided | none, top, bottom, double sided |
| Solder mask colour | green, white, black, blue, red | green, white, black, blue, red and transparent (individual colours on exact colour value - RAL scale) |
| Silk print colour | white | black, blue, yellow, red |
| Via-Filling (no copper lid) | possible | possible |
| Electric test | possible (flying probe) | possible, also adapter |
| Plugging (with copper lid, e.g. for "via-in-pad technology" | not possible | possible |
| Peelable mask | not possible | top, bottom or double sided |
| Beveling | not possible | not possible |
| Surface finish | HAL lead free, i mmersion tin, i mmersion gold (ENIG and ENEPIG) | HAL lead free, i mmersion tin, i mmersion gold (ENIG and ENEPIG) |
| Finger gold | not possible | possible |
| Maximum printed circuit board size 1 and 2 layers PCB | 430 x 275 m m² | 580 x 420 m m² |
| Maximum printed circuit board size for multilayer PCBs | not possible | 430 x 275 m m² |
| Minimum singulated circuit board size | 3c m², smaller can be calculated but will be panelized | >1c m² <3c m² on enquiry |
| Minimum circuit board size in v-cut panels | 5 x 5 m m² | 5 x 5 m m² |
| Minimum circuit boar size in routing panels | 10 x 10 m m², or 1c m² | 10 x 10 m m², or 1c m² |
| Minimum printed circuit board width | 5 mm | 5 mm |
| Lead time options 1 and 2 layers printed circuits | 5WD, 7WD, 9WD, 12WD | 2WD |
| Lead time options 4 to 8 layers multilayer printed circuits | not possible | 10WD |
| Routing | always | always, except punching |
| V-cut | possible | possible |
| Jump-v-cut | possible | possible |
| Punching | not possible | possible |
| Counter-sink-holes | not possible | possible |
| Z-axis milling | not possible | possible |
| Multilayer special stack-up | not possible | possible |
| Panel Production - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| V-cut panel | possible | possible |
| V-Cut - Routing panel (combination) | possible | possible |
| Multi panels (more than one layout per panel) | possible | possible |
| Panel setup (chosen by Leiton) | possible | possible |
| Panel setup (according to drawing) | possible | possible |
| PTH-drills (plated drills) - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest drill 35 µm (final diameter) | 0.20 mm, standard is 0.30 mm | 0.15 mm |
| Smallest drill 70 µm (final diameter) | not possible | 0.20 mm |
| Smallest annular ring 35 µm | 0.15 mm | 0.10 mm |
| Smallest annular ring 70 µm | not possible | 0.12 mm |
| Possibel drill diameters | 0.20 mm to 5.5 mm in 0.05 mm steps | 0.15 mm to 5.5 mm in 0.05 mm steps |
| Drills >5.5 mm | are routed | are routed |
| Smallest drill distance 0.20 mm to 2.00 mm hole size (drill edge to drill edge) | 0.40 mm | 0.30 mm |
| Smallest drill distance 2.05 mm to 5.50 mm hole size (drill edge to drill edge) | 0.50 mm | 0.40 mm |
| Intersecting drills | not possible, will be routed | 1.0 mm to 2.0 mm |
| Half-open PTH on PCB edge | not possible | possible |
| NPTH-drills (non-plated drills) - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smalles drill size (final diameter) | 0.60 mm | 0.30 mm |
| Possible drill sizes | 0.60 mm to 5.5 mm in 0.05 mm steps | 0.30 mm to 5.5 mm in 0.05 mm steps |
| Copper clearance / distance to copper | 0.20 mm | 0.20 mm |
| Drills >5.5 mm | are routed | are routed |
| Minimum drill-to-edge distance | 0.50 mm | 0.50 mm |
| Smallest drill distance 0.20 mm to 2.00 mm hole size (drill edge to drill edge) | 0.40 mm | 0.20 mm |
| Smallest drill distance 2.05 mm to 5.5 mm hole size (drill edge to drill edge) | 0.50 mm | 0.50 mm |
| Intersecting drills | not possible, will be routed | 1.0 mm to 2.0 mm |
| NPTH drills in copper area (without clearance) | not possible (will be cleared from copper by min. 0.2 mm) | on explicit requirement only |
| Blind Vias - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest blind via (final diameter) | not possible | 0.30 mm |
| Smallest Aspect-Ratio | not possible | 1 |
| Smallest annular ring | not possible | 0.125 mm |
| Buried Vias - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest buried via (final diameter) | not possible | 0.20 mm |
| Routing (non-plated) - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Inner routing NPTH | possible | possible |
| Smallest inner routing NPTH | 0.70 mm | 0.70 mm |
| Available routing diameters NPTH | up to 2.0 mm in 0.10 mm steps | up to 2.2 mm in 0.10 mm steps |
| Smallest radius (inner corners) NPTH | 0.35 mm | 0.35 mm |
| Routing (plated) - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Inner routing PTH | partly possible | possible |
| Smallest inner routing PTH (final diameter) | 0.60 mm | 0.60 mm |
| Edge plating (outer edge) | not possible | possible |
| Special routing paths with plating (inner) | partly possible | possible |
| Available routing diameters PTH (final diameter) | up to 1.9 mm in 0.10 mm steps | up to 1.9 mm in 0.10 mm steps |
| Smallest radius (inner corner, final) PTH | 0.30 mm | 0.30 mm |
| Smallest annular ring | 0.20 mm | 0.20 mm |
| Copper Layers (outer) - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest trace 18 µm | not possible | 0.07 mm |
| Smallest trace 35 µm | 0.10 mm; 0.125 mm or 0.15 mm | 0.08 mm |
| Smallest trace 70 µm | not possible | 0.15 mm |
| Smallest trace-to-trace distance 18 µm | not possible | 0.07 mm |
| Smallest trace-to-trace distance 35 µm | 0.10 mm; 0.125 mm or 0.15 mm | 0.08 mm |
| Smallest trace-to-trace distance 70 µm | not possible | 0.15 mm |
| Smallest drill pad | 0.50 mm bei 0.20 mm Bohrungen, Standard ist 0.60 mm | 0.38 mm |
| Smallest copper clearance to inner routing | 0.30 mm | 0.25 mm or 0.0 mm (plated) |
| Smallest copper clearance to board edge (routing) | 0.30 mm | 0.25 mm or 0.0 mm (plated) |
| Smallest copper clearance to board edge (v-cut) | 0.50 mm | 0.40 mm |
| Copper Layers (inner) - Rogers-Multilayer Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest trace 18 µm | not possible | 0.09 mm |
| Smallest trace 35 µm | not possible | 0.10 mm |
| Smallest trace 70 µm | not possible | 0.15 mm |
| Smallest trace-to-trace distance 18 µm | not possible | 0.08 mm |
| Smallest trace-to-trace distance 35 µm | not possible | 0.08 mm |
| Smallest trace-to-trace distance 70 µm | not possible | 0.15 mm |
| Smallest drill-pad diameter | not possible | 0.40 mm |
| Smallest copper clearance to outer edges (routed) | not possible | 0.25 mm |
| Smallest copper clearance to inner edges (routed) | not possible | 0.25 mm |
| Smallest copper clearance to drills | not possible | 0.25 mm |
| Solder Mask - Rigid Multilayer Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
 Smallest solder mask web (straight) |
0.12 mm | 0.10 mm |
 Smallest solder mask web (round) |
0.075 mm | 0.05 mm |
 smallest solder mask size around copper |
0.075 mm | <0 mm |
| Smallest text lines | 0.25 mm | 0.20 mm |
| Silk Print - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest lines | 0.20 mm | 0.15 mm |
| Smallest distance between lines | 0.20 mm | 0.15 mm |
| Minimum clearance to copper pads | 0.20 mm | 0.15 mm |
| Carbon Print - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest pad-to-pad distance | not possible | 0.50 mm |
| Tolerances, Values, Marks & Norms - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Max. offset drill centre to centre of reference | 0.07 mm | 0.05 mm |
| Max. offset solder mask / copper structures | 0.12 mm | 0.075 mm |
| Finished drill sizes PTH (0.55 to 3 mm) | +/-0.10 mm | +/-0.05 mm |
| Finished drill sizes PTH (>3 mm) | +/-0.12 mm | +/-0.10 mm |
| Finished drill sizes NPTH (up to 6 mm) | +/-0.10 mm | +/-0.05 mm |
| Finished drill sizes NPTH (>6 mm) | +/-0.12 mm | +/-0.10 mm |
| Outline | +/-0.20 mm | +/-0.10 mm |
| Max. offset outline/copper structures | +/-0.15 mm | +/-0.10 mm |
| V-cut depth | +/-0.30 mm | +/-0.20 mm |
| Z-axis milling | not possible | +/-0.05 mm |
| V-Cut position to copper structures | +/-0.25 mm | +/-0.15 mm |
| Etch tolerance copper thickness 18 µm | not possible | +0/-0.02 mm |
| Etch tolerance copper thickness 35 µm | +0/-0.03 mm | +0/-0.03 mm |
| Etch tolerance copper thickness 70 µm | not possible | +0/-0.05 mm |
| Material thickness tolerances | <=1.0 mm: +/-15% >1.0 mm: +/-10% 1.55 mm: 1.6 mm +/-10% |
differs, please enquire |
| Copper thickness tolerances | +20% / -15% | +/-10% |
| I mmersion tin thickness | >=0.7 µm | >=1.0 µm |
| HAL lead free thickness | >= 8- bis 10 µm, Kanten >0.5 µm | >= 8- bis 10 µm, Kanten >0.5 µm |
| HAL lead thickness | not possible | >= 8- bis 10 µm, edges >0.5 µm |
| ENIG - I mmersion gold for soldering (nickel thickness) | 2.5 µm to 5 µm | 3 µm to 6 µm |
| ENIG - I mmersion gold for soldering (gold thickness) | 0.05 µm to 0.075 µm | 0.07 µm to 0.12 µm |
| ENEPIG - I mmersion nickel-palladium-gold for gold-wire bonding (nickel thickness) | 4 µm to 8 µm | 4 µm to 8 µm |
| ENEPIG - i mmersion nickel-palladium-gold for for gold-wire bonding (palladium thickness) | 0.1 µm to 0.3 µm | 0.1 µm to 0.3 µm |
| ENEPIG - imersion nickel-palladium-gold for gold-wire bonding (gold thickness) | 0.02 µm to 0.08 µm | 0.02 µm to 0.08 µm |
| I mmersion gold for gold-wire bonding (nickel thickness) | not possible | 3 µm to 6 µm |
| I mmersion gold for gold-wire bonding (gold thickness) | not possible | 0.4 µm to 6 µm |
| I mmersion gold for aluminum-wire bonding (nickel thickness) | 2.5 µm to 5 µm | 3 µm to 6 µm |
| I mmersion gold for aluminum-wire bonding (gold thickness) | 0.05 µm bis 0.075 µm | 0.07 µm bis 0.12 µm |
| Electrolytic connector gold - soft, bonding possible (nickel thickness) | not possible | 4 µm to 8 µm |
| Electrolytic connector gold - soft, bonding possible (gold thickness) | not possible | 0.3 µm to 5 µm |
| Electrolytic connector gold - hard, bonding NOT possible (nickel thickness) | not possible | 4 µm to 8 µm |
| Electrolytic connector gold - hard, bonding NOT possible (gold thickness) | not possible | 0.8 µm to 5 µm |
| Wet solder laquer thickness | >15 µm | >15 µm |
| Copper thickness in plated hole, traces 35 µm | minimum 18 µm | minimum 20 µm |
| Copper thickness in plated hole, traces 70 µm | not possible | minimum 20 µm |
| Winding | max. 1% | max. 0.5% |
| Warping | max. 1% | max. 0.5% |
| Beveling angle | not possible | not possible |
| Base materials RoHS-compliance | yes, always | yes, always |
| Surface finish RoHS-compiance | yes, always | always, unless "HAL lead" is explicitly required |
| IPC-norm | IPC-A-600 - Class 2 | IPC-A-600 - Class 1. 2 or 3 |
| UL-approval of printed circuits (UL number, logo, date code) | not possible | not possible |
| UL-approved base material | yes, always | yes, always |
| Insertion of date code | possible, please mention in enquiry | possible, please mention in enquiry |
| Insertion of supplier logo (Leiton) | possible, please mention in enquiry | possible, please mention in enquiry |
| DIN EN ISO 9001 certification of printed circuit board production | yes | yes |
| DIN EN ISO 14001 certification of printed circuit board production | yes | yes |
| DIN EN ISO 16949 certification of printed circuit board production | no | possible |